metalized Moisture Barrier Bag for microcontroller
Buy metalized Moisture Barrier Bag for microcontroller from KeXinMaterials, China-based manufacturer offering factory-direct pricing, free 5-day prototyping, ISTA-tested packaging, and global shipping. RoHS/REACH compliant.
Application
KeXinMaterials metalized moisture barrier bag for microcontroller are engineered for protection of ESD-sensitive components in manufacturing, shipping, and storage. Common applications include PCB handling, IC packaging, semiconductor wafer transport, and field service deployment. Our metalized moisture barrier bag for microcontroller are designed to meet ANSI/ESD S541 surface resistance requirements and provide a Faraday cage effect for full ESD shielding.
Specifications
Standard specifications for metalized Moisture Barrier Bag for microcontroller: Material: metalized polyester / static-dissipative polyethylene. Surface resistance: 10^6 to 10^11 ohms (per ANSI/ESD S541). Static decay time: < 0.5 seconds. Tensile strength: 35-65 MPa. Temperature range: -40°C to +85°C. Heat sealable. Custom sizes, printing, and thicknesses available.
Testing & Compliance
All metalized Moisture Barrier Bag for microcontroller shipped by KeXinMaterials undergo 100% inline surface-resistance testing. Lot certifications include ANSI/ESD S541 compliance, RoHS / REACH declarations, and traceable lot numbers. Optional third-party testing via SGS, TUV, or Intertek is available on request.
Packaging & MOQ
KeXinMaterials ships metalized Moisture Barrier Bag for microcontroller in heavy-duty double-walled corrugated cartons with PE inner liner. Standard MOQ: 5,000 pieces. Custom-printed or special-spec orders: 10,000 pieces. Free samples available for evaluation. Lead time: 7-12 days for standard SKUs, 15-25 days for custom orders.
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