wafer-conductive-case customization process from KeXinMaterials source factory. OEM/ODM, wholesale, factory-direct pricing. 9 WL series sizes WL1204-WL5020, IP67/MIL-STD-810H certified, MOQ 30, 12h quote, 30-day delivery to 47 countries.
What is wafer-conductive-case customization process, really? The term gets used loosely in the B2B protective case market. Here is the precise definition, what it includes, and what it does not.
Below is the catalog data for wafer-conductive-case customization process. Each model has outer dimensions (in mm), inner cavity (mm), empty weight (g), and material specification. Material is engineering PP or PP+GF for impact resistance. Foam set is included: 25mm base + 10mm lid convoluted.
| Model | Outer (mm) | Inner (mm) | Weight (g) | Material | Size Class |
|---|---|---|---|---|---|
| WL2305 | 230×180×45 mm | 225×150×40 mm | 240 g | PP | Multimeter / Caliper |
| WL2808 | 275×230×82 mm | 265×190×76 mm | 480 g | PP+AS | Surveying Total Station |
| WL6030 | 600×450×300 mm | 575×420×280 mm | 4200 g | PP+AS | Lab / Test Kit |
The most common model for "wafer-conductive-case customization process" buyers is the WL2305 (230×180×45 mm OD, 240 g empty weight, PP body).
Cheap protective cases use 15 kg/m³ foam that bottoms out after 6 months. Our wafer-conductive-case customization process uses 25 kg/m³ foam rated for 5+ year use. The difference is in the cell structure: 25 kg/m³ cells rebound after compression, 15 kg/m³ cells do not. We have tested both. The cheaper foam fails.
The shell is rated IP67 ingress protection and validated to MIL-STD-810H Method 516.8 (26 drops at 1.2m). Temperature range is -40 ~ +80 °C. The automatic pressure-equalization valve keeps the seal intact during air transport and at altitude. Latch is a double-throw design rated for 5,000 open/close cycles. All units are 100% inspected for wall thickness uniformity, latch engagement, and foam adhesion before shipping.
Common equipment we have designed wafer-conductive-case customization process foam layouts for, based on real customer projects since 2014: DSLR + 2-3 lenses, mirrorless kits, cinema cameras with matte box + monitor, drones (DJI Mavic/Phantom/Inspire) with 5 batteries, broadcast lighting kits, military optics, medical devices.
For wafer-conductive-case customization process, the decision comes down to: equipment dimensions (always measure with 5-10mm foam clearance), IP rating (IP65 indoor, IP67 outdoor, IP68 water), and certification (FCC for USA, CE for EU, MIL-STD for military). Beyond that, it is foam layout and quantity discount.
For alternatives: soft padded bags (¥50–200, $7–30) are cheaper but offer no real protection and last 6 months. Aluminum hard cases ($80–300) are heavier, prone to denting, and 2–4× the price. Carbon fiber cases ($300+) are overkill for 95% of B2B use cases. Our PP/PC engineering cases hit the sweet spot: 90% of the protection of aluminum at 30% of the weight and 50% of the cost, with 10-year typical service life.
Standard wafer-conductive-case customization process: MOQ 30 units, 30-day production, T/T 30/70. Custom: MOQ 500 units, 25-30 days mold + 30 days production. We support L/C for >$20,000 orders. Sample lead time 5-7 days, sample cost refundable on >2,000 unit order.
If you do not see your question here, ask us at kexin@beeaa.com. We respond within 12 hours.
Established 2014. 13,000 sqm factory in Fusha Industrial Park, Zhongshan, Guangdong. 12 production lines, 60+ injection molding machines, 100+ employees, 20+ patents. Monthly capacity 80,000 units. Annual export revenue 8M+ USD to 47 countries.
Direct from the OEM. Unlike trading companies or sourcing agents who add 15–40% markup and disappear after delivery, KeXinMaterials handles everything in-house: mold development, injection molding, foam CNC cutting, QC testing, export documentation. Our 2024 buyer survey showed 87% repeat-order rate and 0.3% defect rate across 47 countries.
| Quantity | Unit Price | Discount | Lead Time | Sample |
|---|---|---|---|---|
| 50-99 pcs | USD 15.08 | — | 20 days | Free (pay shipping) |
| 100-199 pcs | USD 13.34 | 5% off | 25 days | Free (pay shipping) |
| 200-499 pcs | USD 11.60 | 10% off | 30 days | Free (pay shipping) |
| 500-999 pcs | USD 10.44 | 15% off | 30 days | Free (pay shipping) |
| 1000+ pcs | USD 9.28 | 20% off | 35-45 days | Free (pay shipping) |
Reference price for WL2305 (230×180×45 mm). Custom sizes, colors, foam add 5–30%. Quote valid 30 days.
wafer-conductive-case customization process: Buyer Decision Tree
Visual summary of the key specifications. Print-friendly for buyer reference.
📹 60-second factory + product walkthrough. wafer-conductive-case customization process buyer guide walkthrough, equipment fitting, quote process
Report within 48 hours with photos. We replace at no cost within 90 days. Defect rate <0.3% in 2024. For OEM/ODM orders, we keep tooling for 3 years — re-orders are 15-20 days lead time.
Every shipment includes a lot certificate with serial numbers, manufacturing date, and QC inspector signature. Cross-check the serial number with our database at kexin@beeaa.com to verify authenticity and view the test report.
OEM: you design, we manufacture. ODM: we design (based on your use case), you brand. OEM requires 3D model / spec sheet from you. ODM requires usage description only. OEM MOQ 500, ODM MOQ 200. Both lead time 25-30 days for tooling.
Yes. Free samples for standard WL series (you pay shipping, $30-80 via DHL). 5-day sample lead time. Custom samples: $200-500 fee (refundable on order >2,000 units), 7-15 day lead time.
No, you can supply your own foam. We can ship the case without foam (15% cost reduction) or with custom foam (your spec). Our standard foam is 25mm base + 10mm convoluted lid, CNC-cut to 0.5mm tolerance.
Free 5-day prototyping. ISO 9001 factory-direct. Ships to 47 countries.