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Heat-resistant esd-chip-case: IP Rating, Certifications, Lab Test Results | KeXinMaterials

Heat-resistant esd-chip-case from KeXinMaterials source factory. OEM/ODM, wholesale, factory-direct pricing. 9 WL series sizes WL1204-WL5020, IP67/MIL-STD-810H certified, MOQ 30, 12h quote, 30-day delivery to 47 countries.

Heat-resistant esd-chip-case: IP-Rated vs IP-Tested

There is a difference between 'IP-rated' and 'IP-tested'. The first is a marketing claim. The second is a third-party certificate. Our Heat-resistant esd-chip-case is the second one.

Heat-resistant esd-chip-case: WL Series Real Catalog Data

We do not round dimensions. We do not approximate. Every line in this table is the real catalog data for Heat-resistant esd-chip-case, measured on the production line, with QC sign-off and lot certificate. This is the data we ship with every order.

ModelOuter (mm)Inner (mm)Weight (g)MaterialSize Class
WL2305 230×180×45 mm 225×150×40 mm 240 g PP Multimeter / Caliper
WL2808 275×230×82 mm 265×190×76 mm 480 g PP+AS Surveying Total Station
WL5020 500×400×200 mm 480×360×185 mm 2400 g PP+AS Optical Microscope

The most common model for "Heat-resistant esd-chip-case" buyers is the WL2305 (230×180×45 mm OD, 240 g empty weight, PP body).

Heat-resistant esd-chip-case: Shell, Foam, Seal, Valve

Four components define Heat-resistant esd-chip-case protection: shell (PP or PP+GF), foam (25 kg/m³ closed-cell PE), seal (silicone gasket around the lid), and pressure valve (automatic Gore-Tex membrane for IP67/IP68). Each component is tested. Each can be replaced if worn.

The shell is rated IP67 ingress protection and validated to MIL-STD-810H Method 516.8 (26 drops at 1.2m). Temperature range is -40 ~ +80 °C. The automatic pressure-equalization valve keeps the seal intact during air transport and at altitude. Latch is a double-throw design rated for 5,000 open/close cycles. All units are 100% inspected for wall thickness uniformity, latch engagement, and foam adhesion before shipping.

Heat-resistant esd-chip-case Foam Layouts: 200+ Reference Designs

We maintain 200+ foam-cut reference designs for Heat-resistant esd-chip-case, covering camera bodies, drone kits, broadcast gear, military equipment, medical devices, and industrial tools. Send us your equipment list, we will match to the closest reference or draft a new layout free within 24 hours.

Heat-resistant esd-chip-case Selection: Per-Profile Recommendations

For Heat-resistant esd-chip-case: filmmakers should prioritize WL2808-WL5020 with custom foam. Drone operators: WL2005-WL2808 with battery cavities. Broadcast: WL3812-WL5020 with monitor + cable management. Military: WL3812-WL5020 with PP+GF and IP67. Medical: WL1504-WL2808 with anti-microbial foam.

For alternatives: soft padded bags (¥50–200, $7–30) are cheaper but offer no real protection and last 6 months. Aluminum hard cases ($80–300) are heavier, prone to denting, and 2–4× the price. Carbon fiber cases ($300+) are overkill for 95% of B2B use cases. Our PP/PC engineering cases hit the sweet spot: 90% of the protection of aluminum at 30% of the weight and 50% of the cost, with 10-year typical service life.

Heat-resistant esd-chip-case After-Sales Support

After Heat-resistant esd-chip-case ships: (1) We send QC photos before shipment. (2) Lot certificate with serial numbers. (3) 90-day defect replacement. (4) Foam re-cut service for equipment changes. (5) 5-year case body warranty. (6) Tooling stored 3 years for easy reorder.

Why Choose KeXinMaterials

We can show you the test videos. Not the 'demo reel' — the actual SGS or TUV third-party test footage, with date and batch number on it.

Key Specifications

Ingress Protection
IP67
Drop Test (MIL-STD-810H)
1.2m / 26 cycles
Temperature Range
-40 ~ +80 °C
Latch Type
Double-Throw Latch
Pressure Valve
Automatic Pressure Equalization
Certifications
ISO 9001:2015, ROHS, CE, IP67, ESD-safe (anti-static foam)

Why Source Directly from KeXinMaterials

Established 2014. 13,000 sqm factory in Fusha Industrial Park, Zhongshan, Guangdong. 12 production lines, 60+ injection molding machines, 100+ employees, 20+ patents. Monthly capacity 80,000 units. Annual export revenue 8M+ USD to 47 countries.

Direct from the OEM. Unlike trading companies or sourcing agents who add 15–40% markup and disappear after delivery, KeXinMaterials handles everything in-house: mold development, injection molding, foam CNC cutting, QC testing, export documentation. Our 2024 buyer survey showed 87% repeat-order rate and 0.3% defect rate across 47 countries.

Bulk Pricing Reference (FOB Shenzhen)

QuantityUnit PriceDiscountLead TimeSample
50-99 pcsUSD 15.08—20 daysFree (pay shipping)
100-199 pcsUSD 13.345% off25 daysFree (pay shipping)
200-499 pcsUSD 11.6010% off30 daysFree (pay shipping)
500-999 pcsUSD 10.4415% off30 daysFree (pay shipping)
1000+ pcsUSD 9.2820% off35-45 daysFree (pay shipping)

Reference price for WL2305 (230×180×45 mm). Custom sizes, colors, foam add 5–30%. Quote valid 30 days.

Quick Reference Infographic

Heat-resistant esd-chip-case: Lab Test Certificate Reference

[ Infographic — generation in progress ]

Visual summary of the key specifications. Print-friendly for buyer reference.

Product Video: Heat-resistant esd-chip-case

📹 Video — Coming Soon
Heat-resistant esd-chip-case lab test footage: water submersion, drop test, temperature chamber
📧 Request Video

📹 60-second factory + product walkthrough. Heat-resistant esd-chip-case lab test footage: water submersion, drop test, temperature chamber

Frequently Asked Questions

What is the fire rating?

UL94 V-2 standard (self-extinguishing within 30 seconds, no flaming drips). Higher UL94 V-0 rating available for select materials. We do not use materials with toxic flame retardants (Deca-BDE, HBCD) per ROHS.

What about chemical resistance?

Resistant to: petroleum products, mineral oil, dilute acids and alkalis, alcohols, and most industrial solvents. Not resistant to: concentrated sulfuric acid, aromatic solvents (benzene, toluene), and prolonged exposure to chlorinated solvents.

Does the case float in water?

Standard PP case: density 0.91 g/cm³, so yes, all our cases float. Foam-filled case with typical payload (5-30kg equipment): overall density may exceed 1.0, may not float. Specify float requirement and we adjust foam density.

What about EMI/RFI shielding?

Standard cases: no EMI/RFI shielding. Optional: conductive coating (nickel or copper) on interior surface for EMI shielding per MIL-STD-285. Adds $5-15 per unit depending on size. Used for sensitive electronic equipment.

What is the RoHS compliance for Heat-resistant esd-chip-case?

ROHS 3 (EU 2015/863): compliant for all 10 restricted substances (Pb, Hg, Cd, Cr6+, PBB, PBDE, DEHP, BBP, DBP, DIBP). Third-party test report issued per batch, available as PDF on request.

Related Resources

Get a 12-Hour Quote for Heat-resistant esd-chip-case

Free 5-day prototyping. ISO 9001 factory-direct. Ships to 47 countries.