esd-chip-case manufacturing process from KeXinMaterials source factory. OEM/ODM, wholesale, factory-direct pricing. 9 WL series sizes WL1204-WL5020, IP67/MIL-STD-810H certified, MOQ 30, 12h quote, 30-day delivery to 47 countries.
What is esd-chip-case manufacturing process, really? The term gets used loosely in the B2B protective case market. Here is the precise definition, what it includes, and what it does not.
If you have not worked with the WL series before, this is the cheat sheet. WL1204-WL1504 are Small (under 200mm). WL1905-WL2808 are Medium (200-300mm). WL3812-WL5020 are Large (300-500mm). Within each tier, the model number encodes the length, width, height in cm.
| Model | Outer (mm) | Inner (mm) | Weight (g) | Material | Size Class |
|---|---|---|---|---|---|
| WL2305 | 230×180×45 mm | 225×150×40 mm | 240 g | PP | Multimeter / Caliper |
| WL2808 | 275×230×82 mm | 265×190×76 mm | 480 g | PP+AS | Surveying Total Station |
| WL3812 | 380×320×120 mm | 365×280×110 mm | 1100 g | PP+AS | Theodolite / Level |
The most common model for "esd-chip-case manufacturing process" buyers is the WL2305 (230×180×45 mm OD, 240 g empty weight, PP body).
Cheap protective cases use 15 kg/m³ foam that bottoms out after 6 months. Our esd-chip-case manufacturing process uses 25 kg/m³ foam rated for 5+ year use. The difference is in the cell structure: 25 kg/m³ cells rebound after compression, 15 kg/m³ cells do not. We have tested both. The cheaper foam fails.
The shell is rated IP67 ingress protection and validated to MIL-STD-810H Method 516.8 (26 drops at 1.2m). Temperature range is -40 ~ +80 °C. The automatic pressure-equalization valve keeps the seal intact during air transport and at altitude. Latch is a double-throw design rated for 5,000 open/close cycles. All units are 100% inspected for wall thickness uniformity, latch engagement, and foam adhesion before shipping.
We maintain 200+ foam-cut reference designs for esd-chip-case manufacturing process, covering camera bodies, drone kits, broadcast gear, military equipment, medical devices, and industrial tools. Send us your equipment list, we will match to the closest reference or draft a new layout free within 24 hours.
For esd-chip-case manufacturing process: filmmakers should prioritize WL2808-WL5020 with custom foam. Drone operators: WL2005-WL2808 with battery cavities. Broadcast: WL3812-WL5020 with monitor + cable management. Military: WL3812-WL5020 with PP+GF and IP67. Medical: WL1504-WL2808 with anti-microbial foam.
For alternatives: soft padded bags (¥50–200, $7–30) are cheaper but offer no real protection and last 6 months. Aluminum hard cases ($80–300) are heavier, prone to denting, and 2–4× the price. Carbon fiber cases ($300+) are overkill for 95% of B2B use cases. Our PP/PC engineering cases hit the sweet spot: 90% of the protection of aluminum at 30% of the weight and 50% of the cost, with 10-year typical service life.
Ordering esd-chip-case manufacturing process is 5 steps: inquiry (12h response), quote (with recommendation), PO + 30% deposit, production (30 days + QC photos), balance payment + shipment. Repeat orders are 15-20 days. Custom OEM/ODM adds 25-30 days for mold.
We can ship a 5-day free sample. We have shipped free samples to 200+ buyers in 2024. Try before you commit.
Established 2014. 13,000 sqm factory in Fusha Industrial Park, Zhongshan, Guangdong. 12 production lines, 60+ injection molding machines, 100+ employees, 20+ patents. Monthly capacity 80,000 units. Annual export revenue 8M+ USD to 47 countries.
Direct from the OEM. Unlike trading companies or sourcing agents who add 15–40% markup and disappear after delivery, KeXinMaterials handles everything in-house: mold development, injection molding, foam CNC cutting, QC testing, export documentation. Our 2024 buyer survey showed 87% repeat-order rate and 0.3% defect rate across 47 countries.
| Quantity | Unit Price | Discount | Lead Time | Sample |
|---|---|---|---|---|
| 50-99 pcs | USD 15.08 | — | 20 days | Free (pay shipping) |
| 100-199 pcs | USD 13.34 | 5% off | 25 days | Free (pay shipping) |
| 200-499 pcs | USD 11.60 | 10% off | 30 days | Free (pay shipping) |
| 500-999 pcs | USD 10.44 | 15% off | 30 days | Free (pay shipping) |
| 1000+ pcs | USD 9.28 | 20% off | 35-45 days | Free (pay shipping) |
Reference price for WL2305 (230×180×45 mm). Custom sizes, colors, foam add 5–30%. Quote valid 30 days.
esd-chip-case manufacturing process: Buyer Decision Tree
Visual summary of the key specifications. Print-friendly for buyer reference.
📹 60-second factory + product walkthrough. esd-chip-case manufacturing process buyer guide walkthrough, equipment fitting, quote process
OEM: you design, we manufacture. ODM: we design (based on your use case), you brand. OEM requires 3D model / spec sheet from you. ODM requires usage description only. OEM MOQ 500, ODM MOQ 200. Both lead time 25-30 days for tooling.
Yes. Free samples for standard WL series (you pay shipping, $30-80 via DHL). 5-day sample lead time. Custom samples: $200-500 fee (refundable on order >2,000 units), 7-15 day lead time.
No, you can supply your own foam. We can ship the case without foam (15% cost reduction) or with custom foam (your spec). Our standard foam is 25mm base + 10mm convoluted lid, CNC-cut to 0.5mm tolerance.
PP case body: 10+ year typical service life with normal use. Foam set: 5+ years before showing compression set. Latch: 5,000-10,000 open/close cycles. Hinge: 10,000 cycles. Replace foam when it no longer rebounds; replace case when latch or hinge fails.
We can re-cut foam for the same case. Cost: $20-50 per foam set depending on size. Lead time: 5-7 days. We keep your foam layout in our database for 3 years for easy re-order. If equipment changes significantly, you may need a different WL series.
Free 5-day prototyping. ISO 9001 factory-direct. Ships to 47 countries.